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PCF8564AU 数据表(PDF) 2 Page - NXP Semiconductors |
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PCF8564AU 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 48 page ![]() PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 August 2013 2 of 48 NXP Semiconductors PCF8564A Real time clock and calendar 4. Ordering information 4.1 Ordering options [1] Bump hardness, see Table 36. 5. Marking Table 1. Ordering information Type number Package Name Description Version PCF8564AU bare die wire bond die; 9 bonding pads PCF8564AU PCF8564AUG bare die 9 bumps PCF8564AUG Table 2. Ordering options Product type number Sales item (12NC) Orderable part number IC revision Delivery form PCF8564AU/10AB/1 935289478005 PCF8564AU/10AB/1,0 1 wafer, sawn, on FFC PCF8564AU/5BB/1 935289319015 PCF8564AU/5BB/1,01 1 unsawn wafer PCF8564AU/5GB/1 935289477015 PCF8564AU/5GB/1,01 1 unsawn wafer PCF8564AU/5GC/1 935293569015 PCF8564AU/5GC/1,01 1 unsawn wafer PCF8564AUG/12HB/1 935301011005 PCF8564AUG/12HB/1V 1 wafer, sawn, on 8 inch metal FFC; chips with soft bumps[1] Table 3. Marking codes Type number Marking code PCF8564AU PC8564A-1 PCF8564AUG PC8564A-1 |
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