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4

REV.02 20120403

MMBZ52xxB Series

PACKAGE OUTLINE & DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

A

B

C

D

G

H

J

K

L

S

V

INCHES

MILLIMETERS

DIM

MIN

M A X

MIN

M A X

2.80

1.20

0.89

0.37

1.78

0.013

0.085

0.45

0.89

2.10

0.45

3.04

1.40

1.11

0.50

2.04

0.100

0.177

0.60

1.02

2.50

0.60

0.1102

0.0472

0.0350

0.0150

0.0701

0.0005

0.0034

0.0180

0.0350

0.0830

0.0177

0.1197

0.0551

0.0440

0.0200

0.0807

0.0040

0.0070

0.0236

0.0401

0.0984

0.0236

(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

SOT-23 Footprint

CASE 318-07

PLASTIC

A

L

S

V

G

1

2

3

C

K

J

B

D

H

STYLE 8:

PIN 1. ANODE

2. NO CONNECTION

3. CATHODE

mm

inches

()

0.037

0.95

0.037

0.95

0.079

2.0

0.035

0.9

0.031

0.8