Three Port 10/100 Managed Ethernet Switch with MII

SMSC LAN9313/LAN9313i

9

Revision 1.9 (03-13-12)

PRODUCT PREVIEW

Notes:

1. All dimensions are in millimeters unless otherwise noted.

2. Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The

base metal is exposed at the lead tip.

3. Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1

and E1 are maximum plastic body size dimensions including mold mismatch.

4. Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the

bottom of the package within 0.05mm.

5. The pin 1 identifier may vary, but is always located within the zone indicated.

Table 2 LAN9313/LAN9313i 128-XVTQFP Dimensions

MIN

NOMINAL

MAX

REMARKS

A

-

-

1.20

Overall Package Height

A1

0.05

-

0.15

Standoff

A2

0.95

1.00

1.05

Body Thickness

D/E

15.80

16.00

16.20

X/Y Span

D1/E1

13.80

14.00

14.20

X/Y Plastic Body Size

D2/E2

6.35

6.50

6.65

X/Y Exposed Pad Size

L

0.45

0.60

0.75

Lead Foot Length

b

0.13

0.18

0.23

Lead Width

c

0.09

-

0.20

Lead Foot Thickness

e

0.40 BSC

Lead Pitch

ddd

0.00

-

0.07

True Position Spread

ccc

-

-

0.08

Coplanarity

Figure 7 LAN9313/LAN9313i 128-XVTQFP Recommended PCB Land Pattern