MCP2003 datasheet(16/34 Pages) MICROCHIP

部件名	MCP2003

功能描述	LIN J2602 Transceiver

PDF	34 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

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16 / 34 page

MCP2003/4/3A/4A

DS22230D-page 16

2.5

Thermal Specifications

THERMAL CHARACTERISTICS

Parameter

Symbol

Typ

Max

Units

Test Conditions

Recovery Temperature

θRECOVERY

+140

—

°C

Shutdown Temperature

θSHUTDOWN

+150

—

°C

Short Circuit Recovery Time

tTHERM

1.5

5.0

Thermal Package Resistances

Thermal Resistance, 8L-DFN

θJA

35.7

—

°C/W

Thermal Resistance, 8L-PDIP

θJA

89.3

—

°C/W

Thermal Resistance, 8L-SOIC

θJA

149.5

—

°C/W

Note 1:

The maximum power dissipation is a function of TJMAX,

ΘJA and ambient temperature T

A. The maximum

allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)

ΘJA. If this dissipation is

exceeded, the die temperature will rise above 150

°C and the device will go into thermal shutdown.

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