Thermal management

L6206Q

22/27

DocID022028 Rev 3

8

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Therefore, it must

be taken into account very carefully. Besides the available space on the PCB, the right

package should be chosen considering the power dissipation. Heat sinking can be achieved

using copper on the PCB with proper area and thickness.

Table 8. Thermal data

Symbol

Parameter

Package

Typ.

Unit

Thermal resistance junction-ambient

1. VFQFPN48 mounted on EVAL6208Q rev. 1.1 board (see EVAL6208Q databrief): four-layer FR4 PCB with

17

°C/W