8

Recommended Pb-Free IR Profile

Solder Reflow Temperature Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160

°C

140

°C

150

°C

PEAK

TEMP.

245

°C

PEAK

TEMP.

240

°C

PEAK

TEMP.

230

°C

SOLDERING

TIME

200

°C

PREHEATING TIME

150

°C, 90 + 30 SEC.

2.5 C ± 0.5

°C/SEC.

3

°C + 1 °C/–0.5 °C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3

°C + 1 °C/–0.5 °C/SEC.

REFLOW HEATING RATE 2.5

°C ± 0.5 °C/SEC.

NOTE: NON-HALIDE FLUX SHOULD BE USED.

217

°C

RAMP-DOWN

6

°C/SEC. MAX.

RAMP-UP

3

°C/SEC. MAX.

150 - 200

°C

* 260 +0/-5

°C

t 25

°C to PEAK

60 to 150 SEC.

15 SEC.

TIME WITHIN 5

°C of ACTUAL

PEAK TEMPERATURE

PREHEAT

60 to 180 SEC.

25

TIME

NOTES:

THE TIME FROM 25

°C to PEAK TEMPERATURE = 8 MINUTES MAX.

NOTE: NON-HALIDE FLUX SHOULD BE USED.

* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245

°C