2

Figure 1. HCMS-2819 package dimension

Package Dimensions

Device Selection Guide

Description

8 Digit 0.15” Character Height

HCMS-2819

Absolute Maximum Ratings

-0.3V to 7.0V

-0.3V to 5.5V

Input Voltage, Any Pin to GND

-40

qC to +85qC

Relative Humidity (non-condensing)

85%

-55

qC to 100qC

Maximum Solder Temperature

Solder Dipping

Wave Soldering

260

qC for 5 sec

250

qC for 3 sec

ESD Protection @ 1.5 k

:, 100pF (each pin)

Class 1, 0-1999V

2.4 W

Notes:

For operation in high ambient temperatures, see Appendix A, Thermal Considerations.

NOTES:

1. DIMENSIONS ARE IN mm (INCHES).

2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON DIMENSIONS IS ± 0.38 mm (0.015 INCH).

3. LEAD MATERIAL: SOLDER PLATED COPPER ALLOY.

2.54 ± 0.13

(0.100 ± 0.005)

(NON ACCUM.)

TYP.

35.56 (1.400) MAX.

7

6

5

4

3

2

1

0

0.25

(0.010)

7.62

(0.300)

PIN # 1 IDENTIFIER

XZ

COO

INTENSITY CATEGORY

DATE CODE (YEAR, WEEK)

COLOR BIN

COUNTRY OF ORIGIN

PART NUMBER

5.08 (0.200)

2.54

(0.100) SYM.

0.51

(0.020)

TYP.

0.51 ± 0.13

(0.020 ± 0.005)

2.22 (0.087) SYM.

10.16 (0.400) MAX.

2.11 (0.083) TYP.

4.32

(0.170)TYP.

1.27

(0.050)SYM.

4.45

(0.175) TYP.

3.71

(0.146) TYP.

NO PIN

NO PIN

V LED

NO PIN

NO PIN

NO PIN

GND LED

NO PIN

NO PIN

V LED

NO PIN

NO PIN

NO PIN

DATA IN

RS

NO PIN

CLOCK

CE

BLANK

GND LOGIC

SEL

V LOGIC

NO PIN

RESET

OSC

DATA OUT

PIN FUNCTION

ASSIGNMENT TABLE

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

PIN # FUNCTION

3

26

HCMS-281X

YYWW