TDA8950J datasheet(21/39 Pages) PHILIPS

21 / 39 page

TDA8950_2

Product data sheet

Rev. 02 — 11 June 2009

21 of 39

NXP Semiconductors

TDA8950

× 150 W class-D power ampliﬁer

The most effective way to avoid pumping effects is to connect the TDA8950 in a mono

full-bridge conﬁguration. In the case of stereo single-ended applications, it is advised to

connect the inputs in anti-phase (see Section 8.4). The power supply can also be

adapted; for example, by increasing the values of the supply line decoupling capacitors.

13.7 Application schematic

Notes on the application schematic:

• Connect a solid ground plane around the switching ampliﬁer to avoid emissions

• Place 100 nF capacitors as close as possible to the TDA8950 power supply pins

• Connect the heatsink to the ground plane or to VSSPn using a 100 nF capacitor

• Use a thermally conductive, electrically non-conductive, Sil-Pad between the

TDA8950 heat spreader and the external heatsink

• The heat spreader of the TDA8950 is internally connected to VSSD

• Use differential inputs for the most effective system level audio performance with

unbalanced signal sources. In case of hum due to ﬂoating inputs, connect the

shielding or source ground to the ampliﬁer ground.

TDA8950J 数据表(PDF) 21 Page - NXP Semiconductors