STPS3L60 datasheet(6/11 Pages) STMICROELECTRONICS

6 / 11 page

Characteristics

STPS3L60

6/11

Doc ID 7505 Rev 6

Figure 15.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 16.

Junction capacitance versus

reverse voltage applied

(typical values)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

Tj=125°C

Tj=25°C

Tj=100°C

V (V)

I (mA)

100

1000

100

F=1MHz

Vosc=30mV

Tj=25°C

V (V)

C(pF)

Figure 17.

Forward voltage drop versus

forward current (high level)

Figure 18.

Forward voltage drop versus

forward current (low level)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

(A)

(V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

(A)

(V)

Figure 19.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMB)

Figure 20.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMBflat)

100

120

0.00.5

1.0

1.5

2.0

2.53.03.5

4.0

4.55.0

SMB

S(Cu)(cm²)

(°C/W)

th(j-a)

copper thickness = 35 µm

Expoxy printed circuit FR4,

100

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB-Flat

S(Cu)(cm²)

(°C/W)

th(j-a)

copper thickness = 35 µm

Expoxy printed circuit FR4,

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