MCP4341502ESLASHML datasheet(3/80 Pages) MICROCHIP

3 / 80 page

DS22233A-page 3

MCP434X/436X

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Voltage on VDD with respect to VSS ................ -0.6V to +7.0V

Voltage on CS, SCK, SDI, SDI/SDO, WP, and

RESET with respect to VSS ................................... -0.6V to 12.5V

Voltage on all other pins (PxA, PxW, PxB, and

SDO) with respect to VSS ............................ -0.3V to VDD + 0.3V

Input clamp current, IIK

(VI < 0, VI > VDD, VI > VPP ON HV pins) ......................±20 mA

Output clamp current, IOK

(VO < 0 or VO > VDD) ..................................................±20 mA

Maximum output current sunk by any Output pin

......................................................................................25 mA

Maximum output current sourced by any Output pin

......................................................................................25 mA

Maximum current out of VSS pin .................................100 mA

Maximum current into VDD pin ....................................100 mA

Maximum current into PXA, PXW & PXB pins ............±2.5 mA

Storage temperature ....................................-65°C to +150°C

Ambient temperature with power applied

.....................................................................-40°C to +125°C

Package power dissipation (TA = +50°C, TJ = +150°C)

TSSOP-14................................................................1000 mW

TSSOP-20................................................................ 1110 mW

QFN-20 (4x4) ...........................................................2320 mW

Soldering temperature of leads (10 seconds) ............. +300°C

ESD protection on all pins

................................... ≥ 4 kV (HBM),

..........................................................................

≥ 300V (MM)

Maximum Junction Temperature (TJ) ......................... +150°C

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

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