ADCMP572/ADCMP573

Rev. A | Page 14 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

3.00

BSC SQ

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

*1.45

1.30 SQ

1.15

EXPOSED

PAD

16

5

13

8

9

12

4

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADCMP572BCP-WP

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G03

ADCMP572BCPZ-WP1

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Y

ADCMP572BCP-R2

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G03

ADCMP572BCP-RL7

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G03

ADCMP572BCPZ-R21

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Y

ADCMP572BCPZ-RL71

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Y

ADCMP573BCP-WP

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G05

ADCMP573BCPZ-WP1

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Z

ADCMP573BCP-R2

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G05

ADCMP573BCP-RL7

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G05

ADCMP573BCPZ-R21

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Z

ADCMP573BCPZ-RL71

−40°C to +85°C

16-Lead LFCSP_VQ

CP-16-2

G0Z

EVAL-ADCMP572BCPZ1

Evaluation Board

EVAL-ADCMP573BCPZ1

Evaluation Board