DAC8248

–5–

REV. B

13. NC

14. DB1

15. DB0(LSB)

16. RESET

17. LSB/MSB

18. DAC A/DAC B

19. LDAC

20. WR

10. DB3

11. DB2

12. NC

SUBSTRATE (DIE BACKSIDE) IS INTERNALLY

DICE CHARACTERISTICS

DAC8248G

Parameter

Symbol

Conditions

Limit

Units

Relative Accuracy

INL

Endpoint Linearity Error

±1

LSB max

Differential Nonlinearity

DNL

All Grades are Guaranteed Monotonic

±1

LSB max

Full-Scale Gain Error

1

Digital Inputs = 1111 1111 1111

±4

LSB max

Output Leakage

Digital Inputs = 0000 0000 0000

Pads 2 and 24

±50

nA max

Input Resistance

Pads 4 and 22

8/15

k

Ω min/kΩ max

∆R

REF

Resistance Match

±1

% max

Digital Input High

2.4

V min

13.5

V min

Digital Input Low

0.8

V max

1.5

V max

Digital Input Current

±1

µA max

Supply Current

2

mA max

0.1

mA max

DC Supply Rejection

(

∆Gain/∆V

PSR

∆V

±5%

0.002

%/% max

NOTES

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

Die Size 0.124

× 0.132 inch, 16,368 sq. mils

(3.15

× 3.55 mm, 10.56 sq. mm)