ADS8344

2

SBAS139E

MINIMUM

RELATIVE

MAXIMUM

SPECIFIED

PACKAGE

ACCURACY GAIN ERROR TEMPERATURE

PACKAGE

DRAWING

ORDERING

TRANSPORT

PRODUCT

(LSB)

(%)

RANGE

DESIGNATOR

PACKAGE-LEAD

NUMBER

NUMBER

MEDIA, QUANTITY

ADS8344E

8

±0.05

–40

°C to +85°C

DBQ

QSOP-20

DBQ

ADS8344E

Rails, 56

"

"

"

"

"

"

"

ADS8344E/2K5

Tape and Reel, 2500

ADS8344N

"

"

"

DB

SSOP-20

DB

ADS8344N

Rails, 68

"

"

"

"

"

"

"

ADS8344N/1K

Tape and Reel, 1000

ADS8344EB

6

±0.024

–40

°C to +85°C

DBQ

QSOP-20

DBQ

ADS8344EB

Rails, 56

"

"

"

"

"

"

"

ADS8344EB/2K5

Tape and Reel, 2500

ADS8344NB

"

"

"

DB

SSOP-20

DB

ADS8344NB

Rails, 68

"

"

"

"

"

"

"

ADS8344NB/1K

Tape and Reel, 1000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at

www.ti.com.

Digital Inputs to GND ........................................................... –0.3V to +6V

Power Dissipation .......................................................................... 250mW

Maximum Junction Temperature ................................................... +150

°C

Operating Temperature Range ........................................ –40

°C to +85°C

Storage Temperature Range ......................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

PIN CONFIGURATION

Top View

SSOP

PIN DESCRIPTIONS

PIN

NAME

DESCRIPTION

1

CH0

Analog Input Channel 0

2

CH1

Analog Input Channel 1

3

CH2

Analog Input Channel 2

4

CH3

Analog Input Channel 3

5

CH4

Analog Input Channel 4

6

CH5

Analog Input Channel 5

7

CH6

Analog Input Channel 6

8

CH7

Analog Input Channel 7

9

COM

Ground reference for analog inputs. Sets zero code

voltage in single–ended mode. Connect this pin to ground

or ground reference point.

10

SHDN

Shutdown. When LOW, the device enters a very

low-power shutdown mode.

11

Voltage Reference Input. See Electrical Characteristics

Table for ranges.

12

Power Supply, 2.7V to 5V

13

GND

Ground

14

GND

Ground

15

Serial Data Output. Data is shifted on the falling edge of

DCLK. This output is high impedance when CS is HIGH.

16

BUSY

are being read and also when the device is converting.

The Output is high impedance when CS is HIGH.

17

Serial Data Input. If CS is LOW, data is latched on rising

18

CS

Chip Select Input. Active LOW. Data will not be clocked

high impedance.

19

DCLK

External Clock Input. The clock speed determines the

20

Power Supply

1

2

3

4

5

6

7

8

9

10

CH0

CH1

CH2

CH3

CH4

CH5

CH6

CH7

COM

SHDN

+V

CC

DCLK

CS

D

IN

BUSY

D

OUT

GND

GND

+V

CC

V

REF

20

19

18

17

16

15

14

13

12

11

ADS8344

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instruments

recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation proce-

dures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.