AME

11

AME8801 / 8812 / 8840

300mA CMOS LDO

Rev.S.02

n Absolute Maximum Ratings

n Recommended Operating Conditions

n Thermal Information

Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device.

* HBM B:2000V~3999V

* Measure

θ

** MIL-STD-202G 210F

Parameter

Package

Die Attach

Symbol

Maximum

Unit

SOT-25

TSOT-25

Conductive Epoxy

81

SOT-26

TSOT-26

Non-Conductive

Epoxy

140

SOT-25

TSOT-25

Conductive Epoxy

260

SOT-26

TSOT-26

Non-Conductive

Epoxy

280

SOT-25

TSOT-25

Conductive Epoxy

400

SOT-26

TSOT-26

Non-Conductive

Epoxy

400

150

350

mW

Solder Iron (10Sec)**

Maximum Junction Temperature

Thermal Resistance *

(Junction to Case)

Thermal Resistance

(Junction to Ambient)

Internal Power Dissipation

Parameter

Symbol

Rating

Unit

Ambient Temperature Range

- 40 to +85

Junction Temperature Range

- 40 to +125

Storage Temperature Range

- 65 to +150

Parameter

Maximum

Unit

Input Voltage

-0.3 to +8

V

EN, BYP Voltage

-0.3 to +8

V

Output Voltage

V

Output Current

mA

ESD Classification

B*