9

Sheet No.: D2-A09201EN

PC4D10SNIP0F Series

■ Manufacturing Guidelines

● Soldering Method

Reflow Soldering:

Reflow soldering should follow the temperature profile shown below.

Soldering should not exceed the curve of temperature profile and time.

Please don't solder more than twice.

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-

low listed guidelines.

Flow soldering should be completed below 270̊C and within 10s.

Preheating is within the bounds of 100 to 150̊C and 30 to 80s.

Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.

Please don't solder more than twice.

Other notice

Please test the soldering method in actual condition and make sure the soldering works fine, since the im-

pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

12

3

4

300

200

100

0

0

(˚C)

Terminal : 260˚C peak

(package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)