L6201 datasheet(14/20 Pages) STMICROELECTRONICS

14 / 20 page

It could be requested to drive a motor at VS lower

than the minimum recommended one of 12V

(See Electrical Characteristics); in this case, by

accepting a possible small increas in the RDS (ON)

resistance of the power output transistors at the

lowest Supply Voltage value, may be a good solu-

tion the one shown in Fig. 20.

THERMAL CHARACTERISTICS

Thanks to the high efficiency of this device, often

a true heatsink is not needed or it is simply ob-

tained by means of a copper side on the P.C.B.

(L6201/2).

Under heavy conditions, the L6203 needs a suit-

able cooling.

By using two square copper sides in a similar way

as it shown in Fig. 23, Fig. 21 indicates how to

choose the on board heatsink area when the

L6201 total power dissipation is known since:

RTh j-amb = (Tj max. – Tamb max) / Ptot

Figure 22 shows the Transient Thermal Resis-

tance vs. a single pulse time width.

Figure 23 and 24 refer to the L6202.

For the Multiwatt L6203 addition information is

given by Figure 25 (Thermal Resistance Junction-

Ambient vs. Total Power Dissipation) and Figure

26 (Peak Transient Thermal Resistance vs. Re-

petitive Pulse Width) while Figure 27 refers to the

single pulse Transient Thermal Resistance.

Figure 20: L6201/1P/2/3 Used at a Supply Volt-

age Range Between 9 and 18V

Figure 21: Typical RTh J-amb vs. "On Board"

Heatsink Area (L6201)

Figure 22: Typical Transient RTH in Single Pulse

Condition (L6201)

Figurre 23: Typical RTh J-amb vs. Two "On Board"

Square Heatsink (L6202)

L6201

L6201PS

L6202

L6203

L6201 - L6202 - L6203

14/20

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