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AD9523-1/PCBZ 数据表(PDF) 39 Page - Analog Devices |
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AD9523-1/PCBZ 数据表(HTML) 39 Page - Analog Devices |
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39 / 60 page ![]() AD9523-1 Rev. B | Page 39 of 60 The second step is to multiply the power dissipated by the thermal impedance to determine the maximum power gradient. For this example, a thermal impedance of θJA = 20.1°C/W was used. Example 1 (966 mW × 20.1°C/W) = 19.4°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 19.4°C = 104°C This junction temperature is below the maximum allowable. Example 2 (2500 mW × 20.1°C/W) = 50.2°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 50°C = 135°C This junction temperature is above the maximum allowable. The ambient temperature must be lowered by 20°C to operate in the condition of Example 2. THERMALLY ENHANCED PACKAGE MOUNTING GUIDELINES Refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), for more information about mounting devices with an exposed paddle. |
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