ADP1755ACPZ-R7 datasheet(5/20 Pages) AD

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Data Sheet

ADP1754/ADP1755

Rev. F | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +4.0 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to VIN

SS to GND

−0.3 V to VIN

PG to GND

−0.3 V to +4.0 V

SENSE/ADJ to GND

−0.3 V to VIN

Storage Temperature Range

−65°C to +150°C

Junction Temperature Range

−40°C to +125°C

Junction Temperature

150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1754/ADP1755 may be damaged if the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that TJ is within the specified

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient temperature

may need to be derated. In applications with moderate power

dissipation and low PCB thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long

as the junction temperature is within specification limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). TJ is calculated using the following formula:

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent

on the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending

on PCB material, layout, and environmental conditions. The

specified values of θJA are based on a 4-layer, 4 in × 3 in circuit

board. Refer to JEDEC JESD51-7 for detailed information about

board construction. For more information, see the AN-772

Application Note, A Design and Manufacturing Guide for the

Lead Frame Chip Scale Package (LFCSP).

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12 document,

Guidelines for Reporting and Using Electronic Package Thermal

Information, states that thermal characterization parameters are

not the same as thermal resistances. ΨJB measures the component

power flowing through multiple thermal paths rather than through

a single path as in thermal resistance, θJB. Therefore, ΨJB thermal

paths include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful in

real-world applications. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and the power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

Refer to the JEDEC JESD51-8 and JESD51-12 documents for more

detailed information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

16-Lead LFCSP with Exposed Pad (CP-16-4)

25.5

°C/W

ESD CAUTION

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