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ADP2108ACBZ-2.3-R7 数据表(PDF) 4 Page - Analog Devices

部件名 ADP2108ACBZ-2.3-R7
功能描述  Compact, 600 mA, 3 MHz, Step-Down DC-to-DC Converter
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP2108ACBZ-2.3-R7 数据表(HTML) 4 Page - Analog Devices

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ADP2108
Data Sheet
Rev. G | Page 4 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VIN, EN
−0.4 V to +6.5 V
FB, SW to GND
−1.0 V to (VIN + 0.2 V)
Operating Ambient Temperature Range
−40°C to +125°C
Operating Junction Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature Range
−65°C to +150°C
Soldering (10 sec)
300°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
ESD Human Body Model
±1500 V
ESD Charged Device Model
±500 V
ESD Machine Model
±100 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
The ADP2108 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that TJ is within the specified temperature limits.
In applications with high power dissipation and poor thermal
resistance, the maximum ambient temperature may have to
be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ)
of the device is dependent on the ambient temperature (TA),
the power dissipation (PD) of the device, and the junction-to-
ambient thermal resistance of the package (θJA). Maximum
junction temperature (TJ) is calculated from the ambient
temperature (TA) and power dissipation (PD) using the formula
TJ = TA + (PD × θJA).
THERMAL RESISTANCE
θJA is specified for a device mounted on a JEDEC 2S2P PCB.
Table 3. Thermal Resistance
Package Type
θJA
Unit
5-Ball WLCSP
105
°C/W
5-Lead TSOT
170
°C/W
ESD CAUTION



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