ADA4661-2ACPZ-R7 datasheet(9/32 Pages) AD

9 / 32 page

Data Sheet

ADA4661-2

Rev. 0 | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

20.5 V

Input Voltage

(V−) − 300 mV to (V+) + 300 mV

Input Current1

±10 mA

Differential Input Voltage

Limited by maximum input

current

Output Short-Circuit

Duration to GND

Refer to the Maximum Power

Dissipation section

Temperature Range

Storage

−65°C to +150°C

Operating

−40°C to +125°C

Junction

−65°C to +150°C

Lead Temperature

(Soldering, 60 sec)

300°C

ESD

Human Body Model2

4 kV

Machine Model3

400 V

Field-Induced Charged-

Device Model (FICDM)4

1.25 kV

The input pins have clamp diodes to the power supply pins and to each

other. Limit the input current to 10 mA or less when input signals exceed the

power supply rail by 0.3 V.

Applicable standard: MIL-STD-883, Method 3015.7.

Applicable standard: JESD22-A115-A (ESD machine model standard of

JEDEC).

Applicable Standard JESD22-C101C (ESD FICDM standard of JEDEC).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages using a

standard 4-layer JEDEC board. The exposed pad of the LFCSP

package is soldered to the board.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead MSOP

142

°C/W

8-Lead LFCSP

83.5

48.51

°C/W

θJC is measured on the top surface of the package.

ESD CAUTION

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