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© Coilcraft Inc. 2013

This product may not be used in medical or high

risk applications without prior Coilcraft approval.

Specification subject to change without notice.

Please check web site for latest information.

Chip Inductor – 1008HT Series (2520)

Document 169-2 Revised 01/18/12

Document 169-2

A

B

C

max

max

max

E

F

G

H

I

J

0.105 0.095 0.045 0.080 0.020 0.060 0.100 0.040 0.050

inches

2,67

2,41

1,14

2,03

0,51

1,52

2,54

1,02

1,27

mm

I

I

J

H

A

B

overall

F

G

E

terminal

F

C

Terminal wraparound:

approx 0.010/0,25 both ends

Recommended

Land Pattern

Pick and

place

material

Typical Q vs Frequency

Typical L vs Frequency

10

100

Frequency (MHz)

1000

10000

100

110

120

60

50

40

30

80

70

90

20

10

0

22 nH

47 nH

3.3 nH

12 nH

100 nH

220 nH

1

10

100

Frequency (MHz)

1000

10000

6.8 nH

27 nH

82 nH

180 nH

270 nH

350

300

250

200

150

100

50

0

Irms Derating

-40

-20

020406080

100

140

120

Ambient temperature (°C)

120

110

100

90

80

70

60

50

40

30

20

10

0

Core material Ceramic

Terminations RoHS compliant silver-palladium-platinum-glass frit.

Other terminations available at additional cost.

Weight 16.0– 17.6 mg

Ambient temperature –40°C to +125°C with

Irms current, +125°C

to +140°C with derated current

Storage temperature Component: –40°C to +140°C.

Tape and reel packaging: –40°C to +80°C

Resistance to soldering heat Max three 40 second reflows at

+260°C, parts cooled to room temperature between cycles

Temperature Coefficient of Inductance (TCL) +25 to +125 ppm/°C

Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /

85% relative humidity)

Failures in Time (FIT) / Mean Time Between Failures (MTBF)

One per billion hours / one billion hours, calculated per Telcordia SR-332

Packaging 2000/7

″reel; 7500/13″ reel Plastic tape: 8 mm wide,

0.23 mm thick, 4 mm pocket spacing, 1.14 mm pocket depth

PCB washing Tested with pure water or alcohol only. For other solvents,

see Doc787_PCB_Washing.pdf.

Note: Height dimension is before optional solder application. For maximum

height dimension including solder, add 0.006 in / 0,152 mm.