AD8099

Data Sheet

Rev. D | Page 24 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE CONNECTION DIAGRAMS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 72. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters

1

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP

VIEW

12° MAX

0.70 MAX

0.65 TYP

0.90 MAX

0.85 NOM

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

4

1.60

1.45

1.30

3.25

3.00 SQ

2.75

2.95

2.75 SQ

2.55

5

8

PIN 1

INDICATOR

SEATING

PLANE

0.30

0.23

0.18

0.60 MAX

0.60 MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE CONNECTION DIAGRAMS

SECTION OF THIS DATA SHEET.

Figure 73. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters