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MLL3595 数据表(PDF) 2 Page - Microsemi Corporation |
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MLL3595 数据表(HTML) 2 Page - Microsemi Corporation |
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2 / 2 page ![]() TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01844 1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803 Website: http: //www.microsemi.com LDS-0027 Rev. 3 (100246) Page 2 of 2 PACKAGE DIMENSIONS NOTE: Dimensions 1. Dimensions are in inches. Ltr Inches Millimeters Notes 2. Millimeters are given for general information only. Min Max Min Max 3. Dimensions are pre-solder dip. BD .063 .067 1.60 1.70 4. Referencing to dimension S, minimum clearance of glass body to BL .130 .146 3.30 3.70 mounting surface on all orientations. ECT .016 .022 0.41 0.55 5. In accordance with ASME Y14.5M, diameters are equivalent to φx S .001 Min 0.03 Min symbology. DESIGN DATA Case: Hermetically sealed glass package per MIL-PRF-19500/241 DO-213AA outline Lead Material: Copper clad steel Lead Finish: Tin / Lead Thermal Impedance (ZθJX): 70°C/W maximum Polarity: Cathode end is banded FIGURE 1. Physical dimensions - 1N3595UR-1, 1N3595AUR-1 (DO-213AA) |
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