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MAT04FSZ 数据表(PDF) 4 Page - Analog Devices |
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MAT04FSZ 数据表(HTML) 4 Page - Analog Devices |
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4 / 12 page ![]() REV. D MAT04 –4– ABSOLUTE MAXIMUM RATINGS 1 Collector-Base Voltage (BVCBO) . . . . . . . . . . . . . . . . . . . 40 V Collector-Emitter Voltage (BVCEO) . . . . . . . . . . . . . . . . . 40 V Collector-Collector Voltage (BVCC) . . . . . . . . . . . . . . . . . 40 V Emitter-Emitter Voltage (BVEE) . . . . . . . . . . . . . . . . . . . 40 V Collector Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Emitter Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Substrate (Pin-4 to Pin-11) Current . . . . . . . . . . . . . . . 30 mA Operating Temperature Range MAT04EY . . . . . . . . . . . . . . . . . . . . . . . . . –25 °C to +85°C MAT04FY, FP, FS . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Y Package . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +125°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 °C Package Type JA 2 JC Units 14-Lead Cerdip 108 16 °C/W 14-Lead Plastic DIP 83 39 °C/W 14-Lead SO 120 36 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2 JA is specified for worst case mounting conditions, i.e., JA is specified for device in socket for cerdip and P-DIP packages; JA is specified for device soldered to printed circuit board for SO package. ORDERING GUIDE TA = 25 C Temperature Package Package Model VOS max Range Description Option MAT04EY* 200 µV –25 °C to +85°C Cerdip Q-14 MAT04FY* 400 µV –40 °C to +85°C Cerdip Q-14 MAT04FP 400 µV –40 °C to +85°C P-DIP-14 N-14 MAT04FS 400 µV –40 °C to +85°C 14-Lead SO SO-14 NOTES *Not for new designs; obsolete April 2002. WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the MAT04 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. DICE CHARACTERISTICS Die Size 0.060 × 0.060 Inch, 3600 Sq. mm (1.52 × 1.52 mm, 2.31 sq. mm) 1. Q1 COLLECTOR 2. Q1 BASE 3. Q1 EMITTER 4. SUBSTRATE 5. Q2 EMITTER 6. Q2 BASE 7. Q2 COLLECTOR 8. Q3 COLLECTOR 9. Q3 BASE 10. Q3 EMITTER 11. SUBSTRATE 12. Q4 EMITTER 13. Q4 BASE 14. Q4 COLLECTOR |
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