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AD625SE 数据表(PDF) 2 Page - List of Unclassifed Manufacturers

部件名 AD625SE
功能描述  MICROCIRCUIT, LINEAR, PROGRAMMABLE GAIN MICROCIRCUIT, LINEAR, PROGRAMMABLE GAIN MONOLITHIC SILICON
PDF  11 Pages
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制造商  ETC2 [List of Unclassifed Manufacturers]
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标志 ETC2 - List of Unclassifed Manufacturers

AD625SE 数据表(HTML) 2 Page - List of Unclassifed Manufacturers

  AD625SE Datasheet HTML 1Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 2Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 3Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 4Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 5Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 6Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 7Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 8Page - List of Unclassifed Manufacturers AD625SE Datasheet HTML 9Page - List of Unclassifed Manufacturers Next Button
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STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87719
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87719
01
E
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows:
Device type
Generic number
Circuit function
01
AD625
Programmable gain instrumentation amplifier
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
E
GDIP1-T16 or CDIP2-T16
16
Dual-in-line
2
CQCC1-N20
20
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (VS) ..................................................................................... ±18 V dc
Internal power dissipation ........................................................................... 280 mW
Input voltage ................................................................................................
±V
S maximum
Storage temperature range ......................................................................... -55
°C to +150°C
Lead temperature (soldering, 10 seconds) .................................................. +300
°C
Thermal resistance:
Junction-to-case (
θ
JC) ..............................................................................
See MIL-STD-1835
Junction-to-ambient (
θ
JA) .........................................................................
95
°C/W
1.4 Recommended operating conditions.
Supply voltage range (VS) ........................................................................... ±6 V dc to ±18 V dc
Ambient operating temperature range (TA) ................................................. -55°C to +125°C



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