102

Revised: July 12, 2010

© 2010 Littelfuse, Inc.

250R Series

Radial Leaded > 250R Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/250R.html for current information.

Environmental Specifications

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

65°C/85°C, 1000 hours

Humidity Aging

+85°C, 85% R.H,.1000 hours

Thermal Shock

MIL–STD–202F, Method 107G

+125°C to -55°C 10 times

Solvent Resistance

MIL–STD–202, Method 215F

Moisture Sesitivity Level

Level 1, J–STD–020C

Physical Specifications

Lead Material

Tin-plated Copper

Soldering

Characteristics

Solderability per MIL–STD–202,

Method 208E

Insulating Material

Cured, flame retardant epoxy polymer

meets UL94V-0 requirements.

Device Labeling

Marked with 'LF', voltage, current rating,

and date code.

Soldering Parameters - Solder Reflow

Condition

Reflow

Peak Temp/ Duration Time

260°C > 5 Sec

> 220°C

30 Sec ~ 60 Sec

Preheat 160°C ~ 190°C

60 Sec ~ 90 Sec

Storage Condition

0°C~35°C,

70%RH

air oven, N

bottom side of the board.

and solvents.

Note: If reflow temperatures exceed the recommended

profile, devices may not meet the performance

requirements.

Preheating

160

190

220

260

0

30 to 60

Soldering

Cooling

120

60 to 90

Time(s)

Soldering Parameters - Wave Soldering

Condition

Wave Soldering

Peak Temp/ Duration Time

260°C

5 Sec

> 220°C

2 Sec ~ 20 Sec

Preheat 140°C ~ 180°C

180 Sec ~ 210 Sec

Storage Condition

0°C~35°C

70%RH

N

side of the board.

and solvents.

Note: If soldering temperatures exceed the recommended

profile, devices may not meet the performance

requirements.

Preheating

160

190

220

260

0

2 to 5

Soldering

Cooling

20-30

180 to 210

Time(s)