4816P-R2R-503 datasheet(61/62 Pages) BOURNS

61 / 62 page

Specifications are subject to change without notice.

337

These are the common

methods, materials and

maximum temperature/

time parameters for

soldering and cleaning

processes:

Soldering/Cleaning Methods

REFLOW

FLOW

Hot Air,

Infrared

Vapor Phase

Wave

Process Step

(Solvent)

(Aqueous)

Material

Solder Paste Printing

RMA

Adhesive Application

Epoxy

Switch Placement

Adhesive Cure

5. Flux Application

Rosin

5. Flux Application

Organic Acid

6. Solder (Reflow)

63/37 Sn/Pb

7. Solder (Flow)

63/37 Sn/Pb

8. Wash (Solvent)

ODS Free

9. Wash (Aqueous)

DI H2O; Detergent

High Pressure Fluids

Ultrasonics

Max. Temp.(°C)/Time (Seconds)

240/30

215/180

260/5

Solder

Reflow; Convection,

IR and Vapor Phase

GENERAL

Preheat sufficiently using both time

and temp. to bring the flux to activa-

tion and minimize thermal shock.

Consult your solder paste supplier for

the recommended profile.

RECOMMENDED

Typical IR/Convection profile.

Use convection or Vapor Phase when

possible and minimize the time above

reflow temperature.

CAUTION

Do not exceed time and temperature

reflow profile of 240°C for 30 sec. for

Hot Air/IR reflow and 215°C for 3

minutes for vapor phase reflow.

Minimize thermal shock by limiting

temperature ramps to 3°C/sec. and by

stabilizing board and component tem-

perature during preheating.

Solder

Flow (Wave)

GENERAL

For maximum component reliability

and performance, minimize the time

of temp. exposure above 200°C.

RECOMMENDED

Typical alloy is Sn63/Pb37. A typical

wave solder zone profile is 245˚C for

5 sec.

CAUTION

Always preheat before the soldier

wave using the temperature for flux

activation recommended by the man-

ufacturer.

Do not exceed 240˚C peak tempera-

ture for dual wave solder process

with a flow zone totaling 5 seconds.

Minimize thermal shock by limiting

temperature ramps to 3˚C/sec. and by

stabilizing board and component

temperature during preheating.

Wash

Solvent

GENERAL

Use solvent cleaning primarily

for nonpolar contaminants

such as rosin based flux

residues.

RECOMMENDED

Use any suitable washing sol-

vents that meet ODS require-

ments.

CAUTION

Limit excessive direct spray

pressure to 60 psi.

Allow the assembly to suffi-

ciently cool prior to the wash-

ing operation for minimized

thermal stress.

Wash

Aqueous

GENERAL

Use aqueous cleaning primarily

for polar contaminants such as

organic flux residues.

RECOMMENDED

Use De-ionized or Reverse

Osmosis water with multistage

rinsing. Post bake at 100˚C for

30 minutes to remove any resid-

ual moisture.

CAUTION

Limit excessive direct spray

pressure to 60 psi.

Allow the assembly to sufficient-

ly cool prior to the washing oper-

ation for minimized thermal

stress.

Board Rework Technique

GENERAL

Excessive and/or repeated high

temperature exposure may

affect the component perfor-

mance and reliability.

RECOMMENDED

Hot air reflow technique is pre-

ferred. Use No Clean or Rosin

based fluxes only, OA fluxes are

recommended.

CAUTION

Avoid the use of wave soldering

or soldering irons as a rework

technique. Avoid repeated and

excessive temperature exposure.

PRE-HEATING

(in air)

SOLDERING GRADUAL COOLING

(in air)

200°C

100°C

0°C

ONE MINUTE

MIN.

20 SECOND

MAX.

230°C

PRE-HEATING

(in air)

SOLDERING GRADUAL COOLING

(in air)

200°C

100°C

0°C

ONE MINUTE

MIN.

5 SECOND

MAX.

245°C

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