Low Resistance Chip Resistor

DOCUMENT

NO.

SRK320000NH

PAGE

REV.

A1

UNLESS OTHERWISE SPECIFIED

TOLERANCES ON ﹕

X

= ±

X.X

= ±

X.XX

= ±

ANGLES ±

HOLE DIA. ±

SCALE ﹕

X

UNIT ﹕ X

APPROVED

BY ﹕

DRAWN

BY ﹕connie 4/3/13

DESIGNED

BY ﹕

CHECKED

BY ﹕

THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc.

AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE

MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

Delta Electronics, Inc.

PAGE

4

OF

9

5-2 Mechanical

Item

Specification and Requirement

Test Method (JIS 5201)

Solderability

The surface of terminal immersed

shall be minimum of 95% covered

with a new coating of solder

Solder bath:

After immersing in flux, dip in

245

± 5℃ molten solder bath for 2 ±

0.5 seconds

Resistance to Solder

Heat

△ R: ± 1.0%

Without distinct deformation in

appearance

(1) Pre-heat: 100~110℃

for 30 seconds

(2) Immersed at solder bath of

270 ± 5℃ for 10 ± 1

seconds

(3) Measuring resistance 1

hour after test

Bending Test

△ R: ± 1.0%

Without mechanical damage such as

break

Bending value: 3 mm for 30 ± 1

seconds

Solvent Resistance

Without mechanical and distinct

damage in appearance

(1) Solvent: Trichloroethane

or Isopropyl alcohol

(2) Immersed in solvent at room

temperature for 300 seconds