RL36370-R002-F datasheet(3/6 Pages) DELTA

3 / 6 page

SPECIFICATION FOR APPROVAL

DOCUMENT : SRG00000NH

REVISION

: A0

PAGE

: 3 OF 6

5. Life test

Test Item

Condition of Test

Requirements

Short Time Overload

5 * Rated power for 5 seconds

Refer to JIS C 5201-1 4.13

ΔR : ± (0.5%+0.0005Ω)

Thermal Shock

-55 ~150℃ 1,000 cycles, 15 min at each

extreme condition

Refer to JIS C 5201-1 4.19

ΔR : ± (1.0%+0.0005Ω)

Low Temperature Storage

Kept at -55℃, 1,000 hours

Refer to JIS C 5201-1 4.23.4

ΔR : ± (1.0%+0.0005Ω)

Resistance to Soldering Heat Dipped into solder at 270

± 5℃ for

± 1 seconds

Refer to JIS C 5201-1 4.29

ΔR : ± (0.5%+0.0005Ω)

Load Life

Rated voltage for 1.5hours followed by a

pause 0.5hour at 70

± 3℃.

Cycle repeated 1000 hours

Refer to JIS C 5201-1 4.25

ΔR : ± (1.0%+0.0005Ω)

Damp Heat with Load

± 2℃ with relative humidity 90% to

95%. Cycle repeated 1,000 hours

Refer to JIS C 5201-1 4.24

ΔR : ± (1.0%+0.0005Ω)

High Temperature Exposure Kept at 170℃ for 1,000 hours

Refer to JIS C 5201-1 4.23.2

ΔR : ± (1.0%+0.0005Ω)

Solderability

Temperature of Solder : 245

± 5℃

Immersion Duration : 3

± 0.5 seconds

Refer to JIS C 5201-1 4.17

Uniform coating of solder

cover minimum of 95%

surface being immersed

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses

Refer to JIS C 5201-1 4.21

ΔR : ± (0.5%+0.0005Ω)

Bending Test

Glass-Epoxy board thickness : 1.6mm

Bending width : 2mm

Between the fulcrums : 90mm

Refer to JIS C 5201-1 4.33

ΔR : ±(0.5%+0.0005Ω)

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