TITLE :

DOCUMENT

NO.

SMK90000NH

PAGE

REV.

A0

UNLESS OTHERWISE SPECIFIED

TOLERANCES ON ﹕

X

= ±

X.X

= ±

X.XX

= ±

ANGLES ±

HOLE DIA. ±

SCALE ﹕

X

UNIT ﹕ X

APPROVED

BY ﹕

DRAWN

BY ﹕connie 4/3/13

DESIGNED

BY ﹕

CHECKED

BY ﹕

THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc.

AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE

MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

Delta Electronics, Inc.

The Engineering Specification for

RL3264L4-9-XXXX-XNH

PAGE

3

OF

6

5. Life test

Test Item

Condition of Test

Requirements

Short Time Overload

2.5 * rated power for 5 seconds

Refer to JIS C 5201-1 4.13

∆R : ± 1.0%

Thermal Shock

-55 ~125℃ 100 cycles, 15 min at each

extreme condition

Refer to JIS C 5201-1 4.19

∆R : ±1.0%

Low Temperature Storage

Kept at -55℃, 1,000 hours

Refer to JIS C 5201-1 4.23.4

∆R : ± 2.0%

Load Life

Rated voltage for 1.5hours followed by a

pause 0.5hour at 70

± 3℃.

Cycle repeated 1000 hours

Refer to JIS C 5201-1 4.25

∆R : ± 2.0%

Damp Heat with Load

40

± 2℃ with relative humidity 90% to

95%. Cycle repeated 1,000 hours

Refer to JIS C 5201-1 4.24

∆R : ± 2.0%

High Temperature Exposure Kept at 170℃ for 1,000 hours

Refer to JIS C 5201-1 4.23.2

∆R : ± 2.0%

Solderability

Temperature of Solder : 245

± 5℃

Immersion Duration : 3

± 0.5 seconds

Refer to JIS C 5201-1 4.17

Uniform coating of solder

cover minimum of 95%

surface being immersed

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses

Refer to JIS C 5201-1 4.21

∆R : ± 1%

Bending Test

Glass-Epoxy board thickness : 1.6mm

Bending width : 2mm

Between the fulcrums : 90mm

Refer to JIS C 5201-1 4.33

∆R : ± 1%