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RL2550L-R050F 数据表(PDF) 4 Page - Delta Electronics, Inc. |
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RL2550L-R050F 数据表(HTML) 4 Page - Delta Electronics, Inc. |
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4 / 8 page ![]() PAGE 4 OF 8 TITLE : DOCUMENT NO. SR550000N PAGE REV. A2 UNLESS OTHERWISE SPECIFIED TOLERANCES ON ﹕ X = ± X.X = ± X.XX = ± ANGLES ± HOLE DIA. ± SCALE ﹕ X UNIT ﹕ X APPROVED BY ﹕ DRAWN BY ﹕connie 4/3/13 DESIGNED BY ﹕ CHECKED BY ﹕ THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc. AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION 台達電子工業股份有限公司 台達電子工業股份有限公司 台達電子工業股份有限公司 台達電子工業股份有限公司 Delta Electronics, Inc. The Engineering Spec. For 3/4W 2010 Low Resistance Chip Resistor 6. Characteristics Test Item Condition of Test Requirements Short Time Overload 2.5 * rated voltage for 5 seconds Refer to JIS C 5201-1 4.13 ∆R : ± (0.5%+0.0005 Ω) Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100 ± 15V DC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G. Between Electrode and Protection Film 100M Ω or over Between Electrode and Substrate 1,000M Ω or over Voltage Proof The voltage : 100VAC (rms.) for 1 minute Refer to JIS C 5201-1 4.7 ∆R : ± (0.5%+0.0005 Ω) Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125℃ 5 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 ∆R : ± (1.0%+0.0005 Ω) Without distinct damage in appearance Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 ∆R : ± (1.0%+0.0005 Ω) Without distinct damage in appearance High Temperature Exposure Kept at 125℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 ∆R : ± (1.0%+0.0005 Ω) Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5℃ Immersion Duration : 3 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 10 ± 1 seconds Refer to JIS C 5201-1 4.18 ∆R : ± (0.5%+0.0005 Ω) Without distinct deformation in appearance |
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