ADA4891-1/ADA4891-2

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage (Common Mode)

Differential Input Voltage

Storage Temperature Range (R)

−65°C to +125°C

Operating Temperature Range (A Grade)

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. It can be calculated by

(2)

where:

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

To ensure proper operating, it is necessary to observe the

maximum power derating curve in Figure 5, where it is derived

safe power dissipation in the package vs. the ambient temperature

for the 5-lead SOT-23 (146°C/W), the 8-lead SOIC (115°C/W),

and the 8-Lead MSOP (133°C/W) on a JEDEC standard

4-layer board.

MAXIMUM POWER DISSIPATION

0

0.5

1.0

2.0

1.5

–55

–35

–15

5

25

45

65

85

105

125

AMBIENT TEMPERAURE (°C)

The maximum power that can be safely dissipated by the

ADA4891-1/ADA4891-2 is limited by the associated rise in

junction temperature. The maximum safe junction temperature

for plastic encapsulated devices is determined by the glass

transition temperature of the plastic, approximately 150°C.

Temporarily exceeding this limit can cause a shift in parametric

performance due to a change in the stresses exerted on the die

by the package. Exceeding a junction temperature of 175°C for

an extended period can result in device failure.

The junction temperature can be calculated as

(1)

8-LEAD MSOP

8-LEAD SOIC

5-LEAD SOT-23

Figure 5. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION