OP200

Data Sheet

Rev. E | Page 16 of 16

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

16

9

8

1

1.27 (0.0500)

BSC

Figure 38. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-16)

S-Suffix

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

OP200AZ

75

−55°C to +125°C

8-Lead CERDIP

Z-Suffix (Q-8)

OP200EZ

75

−40°C to +85°C

8-Lead CERDIP

Z-Suffix (Q-8)

OP200GPZ

200

−40°C to +85°C

8-Lead PDIP

P-Suffix (N-8)

OP200GS

200

−40°C to +85°C

16-Lead SOIC_W

S-Suffix (RW-16)

OP200GSZ

200

−40°C to +85°C

16-Lead SOIC_W

S-Suffix (RW-16)

OP200GSZ-REEL

200

−40°C to +85°C

16-Lead SOIC_W

S-Suffix (RW-16)

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registered trademarks are the property of their respective owners.

D00322-0-9/12(E)