Copyright

© ANPEC Electronics Corp.

Rev. A.2 - May., 2010

APL3513

www.anpec.com.tw

2

Ordering and Marking Information

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

VIN Input Voltage (VIN to GND)

-0.3 ~ 7

V

VOUT to GND Voltage

-0.3 ~ 7

V

EN, ENB to GND Voltage

-0.3 ~ 7

V

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

TDFN2x2-8

80

Note 2 :

θ

of TDFN2x2-8 is soldered directly on the PCB.

APL3513

Package Code

QB : TDFN2x2-8

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

Handling Code

Temperature Range

Package Code

APL3513 QB:

L13

X

X - Date Code

Assembly Material

Symbol

Parameter

Range

Unit

VIN Input Voltage

2.7 ~ 5.5

V

OUT Output Current

0 ~2

A

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125

Note 3 : Refer to the typical application circuit