CH

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Vishay Sfernice

Revision: 28-Aug-13

2

Document Number: 53014

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

• Suggested land pattern: According to IPC-7351



Dimension and tolerance of land pattern shall be defined by PCB designer; PCB can be designed according to IPC-7351A

“Generic Requirements for Surface Mount Design and Land Pattern Standard”

Example of land pattern: Fabrication allowance, assembly location and min. or max. level density board are not included in the

exemple bellow.

with C: “Unilateral profile tolerance for the component”;

F: ”Unilateral profile tolerance for the board land pattern”;

and P: “Diameter of true position placement accuracy to the center of land pattern”.

For

rectangular

component

Flip-Chip

mounting,

we

suggest:

Note

 to 500  in 02016 is 2 %

LAND PATTERN FLIP CHIP TERMINATIONS in millimeters

CHIP SIZE

02016

0.53

0.44

0.15

0402

1.4

0.650

0.4

0603

1.71

0.9

0.760

G

min.

Z

max.

X

max.

C

A

2

F

2

P

2

++



C

F

2

F

2

P

2

++



C

B

2

F

2

P

2

++



COMPONENT

J

H

J

S

J

T

Land Pattern Footprint

JT (TOE)

0 mm

JH (HELL)

0 mm

JS (SDE)

0 mm

WRAPAROUND TERMINATIONS in millimeters

CHIP SIZE

0402

1.55

0.15

0.73

0603

2.37

0.35

0.98

TOLERANCE VS. OHMIC VALUES

Ohmic range

10

  R < 50 

50

 R < 100 

100

Tolerance

5 %, 10 %

2 %, 5 %, 10 %

1 %, 2 %, 5 %, 10 %

G

min.

Z

max.