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APA2011 数据表(PDF) 21 Page - Anpec Electronics Coropration |
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APA2011 数据表(HTML) 21 Page - Anpec Electronics Coropration |
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21 / 27 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.4 - Aug., 2013 www.anpec.com.tw 21 APA2011/2011A Layout Recommendation (Cont.) Application Information (Cont.) 2. The output traces should be short, wide (>50mil) and symmetric. 3. The input trace should be short and symmetric. 4. The power trace width should greater than 50mil. 5. The TDFN3x3-8 Thermal PAD should be soldered on PCB, and the ground plane needs soldered mask (to avoid short circuit) except the Thermal PAD area. |
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