Low Value Flat

Chip Resistor

LRC/LRF Series

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

© TT electronics plc

03.13

Low Value Flat

Chip Resistor

LRC/LRF Series

Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com

04.10

Welwyn Components

Dimensions (mm)

A

B

C

LR1206

2.0

4.0

1.25

LR2010

3.05

6.5

1.5

LR2512

3.7

7.75

1.5

Note:

1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic

chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.

2. Full AEC-Q200 qualification applies to ohmic values

A

C

B

LRC-LRF_E.qxd

12/23/04

10:07 AM

Page 2

LRC 2512 1 w

att

LRC 2512 2 w

att

LRC 2010 0.5

watt

LRC 2010 1 w

att

LRC 1206

0.25 watt

LRC 1206

0.5 watt

25

70

150 (°C)

0

20

40

60

80

100

(%)

Ambient temperature

Ordering Procedure

Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces

L R F 2 5 1 2 – R 0 1 G W

Type

Mounting

Conventional (element up)

Values > R025

F

Flip-chip (element down)

Size

Value (use IEC62 code)

Tolerance (use IEC62 code)

F

1%

G

2%

J

5%

Packing

W

Tape

1206 or 2010

3000/reel

Standard

2512

1800/reel

T1

All sizes

1000/reel

Values < R025

AEC-Q200 Table 7

Method

Max.

(add R05)

Typ.

(@1R0)

ref

Test

3

High Temp. Exposure MIL-STD-202 Method 108

R% 0.5

0.2

4

Temperature Cycling

JESD22 Method JA-104

R% 0.25 0.1

6

Moisture Resistance MIL-STD-202 Method 106

R% 0.5

0.2

7

Biased Humidity MIL-STD-202 Method 103

R% 0.5

0.2

8 Operational Life (Cyclic Load) MIL-STD-202 Method 108

R%

1

0.5

14

Vibration MIL-STD-202 Method 204

R% 0.5 0.05

15 Resistance to Soldering Heat MIL-STD-202 Method 210

R% 0.25 0.05

16

Thermal Shock MIL-STD-202 Method 107

R% 0.25 0.1

18

Solderability

J-STD-002

>95% coverage

21

Board Flex

AEC-Q200-005

R% 0.5

0.2

22

Terminal Strength

AEC-Q200-006

R% 0.25 0.1

Short Term Overload

6.25 x Pr for 2s

R% 0.5

Low Temperature Storage

-65°C for 100 hours

R% 0.5

Leach Resistance

Solder dip at 250°C

90s minimum