AD8145

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

MAXIMUM POWER DISSIPATION

Table 3.

Parameter

Rating

Supply Voltage

12 V

Power Dissipation

See Figure 2

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

The maximum safe power dissipation in the AD8145 package is

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8145. Exceeding a junction temperature

of 150°C for an extended period can result in changes in the

silicon devices, potentially causing failure.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

drive depends on the particular application. For each output, the

power due to load drive is calculated by multiplying the load

current by the associated voltage drop across the device. The

power dissipated due to all of the loads is equal to the sum of

the power dissipation due to each individual load. RMS voltages

and currents must be used in these calculations.

THERMAL RESISTANCE

specified for a device soldered in the circuit board with its

exposed paddle soldered to a pad on the PCB surface, which is

thermally connected to a copper plane.

addition, more metal directly in contact with the package leads

from metal traces, through-holes, ground, and power planes

package must be soldered to a pad on the PCB surface, which is

Table 4. Thermal Resistance

Package Type

Unit

5 mm × 5 mm, 32-Lead LFCSP

47

8.5

°C/W

4.5

0

–40

–20

0

20

40

60

80

100

AMBIENT TEMPERATURE (°C)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 32-lead LFCSP

(47°C/W) on a JEDEC standard 4-layer board with the underside

paddle soldered to a pad, which is thermally connected to a

PCB plane.

ESD CAUTION

Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board