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ADS5520

Serial Programming Register

Control Logic

Timing Circuitry

Internal

Reference

Output

Control

CLKOUT

CLK+

CLK−

CM

OVR

DFS

Digital

Error

Correction

12-Bit

Pipeline

ADC Core

S&H

SCLK

SDATA

SEN

D0

D11

ADS5520

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

ADS5520IPAP

Tray, 160

ADS5520

PAP

–40°C to 85°C

ADS5520I

PowerPAD

ADS5520IPAPR

Tape and Reel, 1000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet.

(2)

Thermal pad size: 3,5 mm x 3,5 mm (min), 4 mm x 4 mm (max).

θ

trace and pad soldered directly to a JEDEC standard, four-layer, 3 in x 3 in PCB.

2

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Product Folder Link(s): ADS5520