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THS3115IPWPRG4 数据表(PDF) 18 Page - Texas Instruments

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部件名 THS3115IPWPRG4
功能描述  LOW-NOISE, HIGH-SPEED, CURRENT FEEDBACK AMPLIFIERS
PDF  35 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

THS3115IPWPRG4 数据表(HTML) 18 Page - Texas Instruments

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background image
-
40
-
20
0
20
40
60
80
100
T
Free-AirTemperature( C)
-
A
°
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
T =+125
J
C
°
q
=158
/W
JA
C
°
q
=95
/W
JA
C
°
q
=58.4
/W
JA
C
°
THS3112
THS3115
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
www.ti.com
For systems where heat dissipation is more critical,
the THS3115 and THS3112 are also available in an
8-pin MSOP with PowerPAD package that offers
even
better
thermal
performance.
The
thermal
coefficient
for
the
PowerPAD
packages
are
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in
Figure 52 for the available packages. The data for the
PowerPAD packages assume a board layout that
follows the PowerPAD layout guidelines discussed
above and detailed in the PowerPAD application note
(literature
number
SLMA002).
Figure
52
also
illustrates the effect of not soldering the PowerPAD to
a
PCB.
The
thermal
impedance
increases
substantially, which may cause serious heat and
performance issues. Always solder the PowerPAD to
Results shown are with no air flow and PCB size of 3 in × 3 in
the PCB for optimum performance.
(76,2 mm × 76,2 mm).
When determining whether or not the device satisfies
•
qJA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN
the maximum power dissipation requirement, it is
package)
important to not only consider quiescent power
•
qJA = 95°C/W for 8-pin SOIC High-K test PCB (D package)
dissipation, but also dynamic power dissipation. Often
•
qJA = 158°C/W for 8-pin MSOP with PowerPAD without solder
times, this type of dissipation is difficult to quantify
Figure 52. Maximum Power Dissipation vs
because the signal pattern is inconsistent, but an
Ambient Temperature
estimate of the RMS power dissipation can provide
visibility into a possible problem.
18
Submit Documentation Feedback
Copyright © 2001–2010, Texas Instruments Incorporated
Product Folder Link(s): THS3112 THS3115



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