MP201 datasheet(2/12 Pages) MPS

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MP201 – DYING GASP STORAGE AND RELEASE CONTROL IC

MP201 Rev. 1.01

www.MonolithicPower.com

11/27/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP201DS

SOIC-8

MP201

* For Tape & Reel, add suffix –Z (eg.MP201DS–Z);

For RoHS compliant packaging, add suffix –LF (e.g. MP201DS–LF–Z)

PACKAGE REFERENCE

BST

VIN

FB2

GND

VMAX

STRG

GASP

FB1

TOP VIEW

SOIC-8

ABSOLUTE MAXIMUM RATINGS (1)

VIN ..................................................-0.3V to 22V

VBST. ................................................-0.3V to 40V

VBST-VIN………………………………-0.3V to 25V

VMAX.................................................-0.3V to 42V

VMAX-VIN………………………….......-0.3V to 25V

VSTRG ...............................................-0.3V to 32V

VSTRG-VIN……………………………..-0.3V to 25V

VGASP ...............................................-0.3V to 22V

All Other Pins.................................-0.3V to 6.5V

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Continuous Power Dissipation (TA = +25°C)

(2)

........................................................... 1.39W

Junction Temperature...............................150

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 18V

Storage Voltage VSTRG ........................................

................................Vin to 2×VIN-0.8V(32V max)

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC-8.................................... 90 ...... 45...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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