MP2403DN datasheet(2/13 Pages) MPS

2 / 13 page

MP2403 – 3A, 32V, 250kHz INTEGRATED SYNCHRONOUS STEP-DOWN CONVERTER

MP2403 Rev.1.0

www.MonolithicPower.com

4/20/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP2403DN

SOIC8N

(Exposed Pad)

MP2403DN

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2403DN–Z).

For Lead Free, add suffix –LF (e.g. MP2403DN–LF–Z)

PACKAGE REFERENCE

GND

COMP

CONNECT EXPOSED PAD

AND GND PIN TO A CERTAIN

GROUND PLANE

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ........................-0.3V to +35V

Switch Voltage VSW ..................-1V to VIN + 0.3V

Boost Voltage VBS .......... VSW - 0.3V to VSW + 6V

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation (TA = +25°C)

(2)

………………………………………………....2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature .............. -65°C to +150°C

Recommended Operating Conditions

(3)

Input Voltage VIN ..............................4.6V to 32V

Output Voltage VOUT.......................0.80V to 28V

Operating Junct. Temp (TJ)........-40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8N...................................50 ...... 10 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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