MP2489 datasheet(2/13 Pages) MPS

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MP2489 – STEP DOWN WLED DRIVER WITH WIDE 6V–60V INPUT VOLTAGE

MP2489 Rev. 1.23

www.MonolithicPower.com

10/11/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP2489DJ*

TSOT23-5

AAD

MP2489DQ

QFN6 (3x 3mm)

MP2489DN

SOIC8E

MP2489

For Tape & Reel, add suffix –Z (e.g. MP2489DJ–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP2489DJ–LF–Z)

PACKAGE REFERENCE

GND

EN/DIM

GND

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

TSOT23-5

QFN6 (3x 3mm)

SOIC8E

ABSOLUTE MAXIMUM RATINGS

(1)

VIN, VSW .........................................-0.3V to +65V

VRS ..................................................VIN-5V to VIN

All Other Pins...............................-0.3V to +6.3V

Continuous Power Dissipation

(TA = +25°C)

(2)

TSOT23-5 .................................................. 1.3W

QFN6 ......................................................... 2.5W

SOIC8E...................................................... 2.6W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ..............................6V to 60V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

TSOT23-5 .............................100 ..... 55 ...

°C/W

QFN6 (3mm x 3mm) ..............50 ...... 14 ...

°C/W

SOIC8E ..................................48 ...... 10 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operation conditions.

4) Measured on JESD51-7, 4-layer PCB.

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