MP2493DN datasheet(2/12 Pages) MPS

2 / 12 page

MP2493 – 2A, 36V, LOW EMI STEP-DOWN WITH PROGRAMMABLE OUTPUT CURRENT LIMIT

MP2493 Rev. 0.9

www.MonolithicPower.com

4/23/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Free Air Temperature (TA)

MP2493DS*

SOIC8

MP2493DS

–40

°C to +85°C

MP2493DN**

SOIC8E

MP2493DN

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP2493DS–Z);

For RoHS, compliant packaging, add suffix –LF(e.g. MP2493DS–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP2493DN–Z);

For RoHS, compliant packaging, add suffix –LF(e.g. MP2493DN–LF–Z)

PACKAGE REFERENCE

VIN

GND

BST

ISP

ISN

TOP VIEW

VIN

GND

BST

ISP

ISN

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

SOIC8

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 40V

VSW....................................... –0.3V to VIN + 0.3V

VBST ................................................... VSW + 6.5V

VISN, vISP................................................0V to15V

All Other Pins..............................–0.3V to +6.5V

Continuous Power Dissipation

(TA = +25°C)

(2)

SOIC8………………………………………...1.4W

SOIC8E……………………………………....2.5W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 36V

Output Voltage VOUT (VIN>16.5V) .....0.8V to 15V

Output Voltage VOUT (VIN<=16.5V) ......................

........................................0.8V to (VIN–1.5) V

Operating Junction Temperature (TJ)

................................................ –40

°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8 .....................................90 ...... 45 ...

°C/W

SOIC8E...................................50 ...... 10 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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