MP2495DS datasheet(2/13 Pages) MPS

2 / 13 page

MP2495– INTEGRATED100VLOAD DUMPPROTECTION,2ASTEPDOWNREGULATORWITH OUTPUTCURRENTCONTROL

MP2495 Rev. 1.0

www.MonolithicPower.com

7/24/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP2495DS

SOIC16

MP2495DS

* For Tape & Reel, add suffix –Z (e.g. MP2495DS–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP2495DS–LF–Z)

PACKAGE REFERENCE

ISP

ISN

N/C

GND

VDD

BST

CTR

OUT

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage IN ...................................... 100V

IN to CTR......................................-0.3V to 100V

OUT to CTR ....................................-0.3V to 45V

VDD ............................................................... 40V

VSW...................................... –0.3V to VDD + 0.3V

VBST ................................................... VSW + 6.5V

VISN, vISP................................................0V to15V

All Other Pins..............................–0.3V to +6.5V

Continuous Power Dissipation

(TA = +25°C)

(2)

........................................................... 1.56W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Input Voltage.....................................6.5V – 16V

VIN Max Transient ............. 80V/100ms duration

Input Voltage....................................6.5V to 18V

VIN Max Transient ............. 70V/100ms duration

VDD ............................................................... 36V

Output Voltage VOUT (VIN>16.5V) .....0.8V to 15V

Output Voltage VOUT (VIN≤16.5V).. 0.8V to (VIN–1.5)V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC16 ...................................80 ...... 30 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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