MP2497DN datasheet(2/14 Pages) MPS

2 / 14 page

MP2497 – 3A, 50V, 100kHz STEP-DOWN CONVERTER

MP2497 Rev. 1.12

www.MonolithicPower.com

12/22/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Operating Temperature (TJ)

MP2497DS*

SOIC8

MP2497

-40

°C to +125°C

MP2497DN**

SOIC8E

MP2497

-40

°C to +125°C

* For Tape & Reel, add suffix –Z (e.g. MP2497DS–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2497DS–LF–Z).

** For Tape & Reel, add suffix –Z (e.g. MP2497DN–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2497DN–LF–Z).

PACKAGE REFERENCE

SOIC8

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Input Voltage VIN .......................................... 60V

VISN, VISP ..............................................0V to 25V

|VISN -VISP| ...........................................0V to 0.4V

VSW........................................-0.3V to VIN + 0.3V

VBST ................................................... VSW + 6.5V

All Other Pins...............................-0.3V to +6.5V

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8 ...................................................... 1.38W

SOIC8E...................................................... 2.5W

Recommended Operating Conditions

(3)

Input Voltage VIN ..............................4.5V to 50V

Output Voltage VOUT (VIN>26.5V) .....0.8V to 25V

Output Voltage VOUT (VIN<=26.5V) ......................

.........................................0.8V to (VIN–1.5)V

Maximum Junction Temp. (TJ) ................+125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8..................................... 90 ...... 45...

°C/W

SOIC8E .................................. 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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