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MP3386EY 数据表(PDF) 2 Page - Monolithic Power Systems |
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MP3386EY 数据表(HTML) 2 Page - Monolithic Power Systems |
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2 / 14 page ![]() MP3386- 50V, 6 STRINGS WHITE LED DRIVERS MP3386 Rev. 1.0 www.MonolithicPower.com 2 1/19/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP3386DR* QFN24 (4x4mm) 3386DR -40 °C to +85°C MP3386EY** SOIC28 3386EY -20 °C TO +85°C * For Tape & Reel, add suffix –Z (e.g. MP3386DR–Z). For RoHS Compliant Packaging, add suffix –LF (e.g. MP3386DR–LF–Z) * * For Tape & Reel, add suffix –Z (e.g. MP3386EY–Z). For RoHS Compliant Packaging, add suffix –LF (e.g. MP3386EY–LF–Z) PACKAGE REFERENCE TOP VIEW 1 2 3 4 5 6 18 17 16 15 14 13 EN OSC FSET PWMO GND PWM1 EXPOSED PAD CONNECT TO GND PGND1 PGND2 OVP VOUT NC LED1 789 10 11 12 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 TOP VIEW VFAULT PWMO VOUT VCC NC EN LED1 OVP VIN COMP OSC AGND FSET PWMI SW2 PGND1 NC NC PGND2 NC ISET NC LED2 LED4 LED3 LED5 LED6 SW1 QFN24 (4x4mm) SOIC28 ABSOLUTE MAXIMUM RATINGS (1) VIN .................................................-0.3V to +30V VVFAULT...........................................VIN - 6V to VIN VSW, VOUT, VLED1 to VLED6 ..................-1V to +50V All Other Pins..................................-0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) QFN24 (4x4mm)…………………………….2.9W SOIC28…………………………… ….…....2.1W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ...........................4.5V to 25V Maximum Junction Temp. (TJ) .............. +125°C Thermal Resistance (4) θJA θJC QFN24 (4x4mm) ....................42 ....... 9 .... °C/W SOIC28 ..................................60 ...... 30 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operation conditions. 4) Measured on JESD51-7, 4-layer PCB.. |
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