| 数据搜索系统,热门电子元器件搜索 |
|
MP3389EF 数据表(PDF) 2 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP3389EF 数据表(HTML) 2 Page - Monolithic Power Systems |
|
2 / 16 page ![]() MP3389—12-STRING WHITE LED DRIVER WITH STEP-UP CONTROLLER MP3389 Rev. 1.04 www.MonolithicPower.com 2 3/27/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP3389EF TSSOP28 3389EF MP3389EY SOIC28 3389EY * For Tape & Reel, add suffix –Z (eg. MP3389EF–Z). For RoHS compliant packaging, add suffix –LF (eg. MP3389EF–LF–Z) ** For Tape & Reel, add suffix –Z (eg. MP3389EY–Z). For RoHS compliant packaging, add suffix –LF (eg. MP3389EY–LF–Z) PACKAGE REFERENCE NC VIN VCC COMP EN DBRT GND OSC ISET BOSC LED12 LED11 LED10 LED9 NC VFAULT GATE PGND ISENSE OVP LED1 LED2 LED3 LED4 LED5 LED6 LED7 LED8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 TOP VIEW TSSOP28 SOIC28 ABSOLUTE MAXIMUM RATINGS (1) VIN .................................................-0.3V to +30V VVFAULT........................................... VIN - 6V to VIN VGATE ..............................................-0.5V to 6.3V VLED1 to VLED12 ..................................-1V to +50V All Other Pins...............................-0.3V to +6.3V Continuous Power Dissipation (TA = +25°C) (2) TSSOP28……………………………… ...3.9W SOIC28………………………………… ...2.1W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ..............................5V to 28V LED Current (Backlight) .............10mA to 60mA Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (4) θJA θJC TSSOP28................................32 ....... 6 .... °C/W SOIC28 ..................................60 ...... 30 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operation conditions. 4) Measured on JESD51-7, 4-layer PCB. |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |