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MP3391EF 数据表(PDF) 3 Page - Monolithic Power Systems |
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MP3391EF 数据表(HTML) 3 Page - Monolithic Power Systems |
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3 / 18 page ![]() MP3391—8-CHANNEL, 120mA/CH STEP-UP WLED DRIVER CONTROLLER MP3391 Rev. 1.11 www.MonolithicPower.com 3 3/14/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP3391EF* TSSOP28 MP3391EF -20 °C to +85°C MP3391EY** SOIC28 MP3391EY -20 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP3391EF–Z). For RoHS compliant packaging, add suffix –LF (eg. MP3391EF–LF–Z) ** For Tape & Reel, add suffix –Z (eg. MP3391EY–Z). For RoHS compliant packaging, add suffix –LF (eg. MP3391EY–LF–Z) PACKAGE REFERENCE TSSOP28 SOIC28 ABSOLUTE MAXIMUM RATINGS (1) VIN .................................................-0.3V to +40V VFAULT ..............................................VIN-6V to VIN VGATE ...............................................-0.5V to 12V VLED1 to VLED8....................................-1V to +55V All Other Pins...............................-0.3V to +6.3V Continuous Power Dissipation (TA = +25°C) (2) TSSOP28……………………………… ...3.9 W SOIC28………………………………… ...2.1W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ..............................9V to 35V LED Current (Backlight) ...........10mA to 120mA Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC TSSOP28................................32 ....... 6 .... °C/W SOIC28 ..................................60 ...... 30 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operation conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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