MP3394EY datasheet(2/17 Pages) MPS

2 / 17 page

MP3394—4-STRING, MAX 200mA/STRING WHITE LED DRIVER

MP3394 Rev. 1.07

www.MonolithicPower.com

3/21/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP3394EF*

TSSOP16EP

MP3394

MP3394ES**

SOIC16

MP3394

MP3394EY***

SOIC20

MP3394

*For Tape & Reel, add suffix –Z (e.g. MP3394EF–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP3394EF–LF–Z)

**For Tape & Reel, add suffix –Z (e.g. MP3394ES–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP3394ES–LF–Z)

***For Tape & Reel, add suffix –Z (e.g. MP3394EY–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP3394EY–LF–Z)

PACKAGE REFERENCE

TOP VIEW

OVP

LED1

VCC

VIN

GATE

ISENSE

GND

COMP

ISET

DBRT

OSC

LED4

BOSC

LED2

LED3

TSSOP16EP

SOIC16

SOIC20

ABSOLUTE MAXIMUM RATINGS (1)

VIN .................................................-0.3V to +30V

VGATE ..............................................-0.5V to 6.8V

VCC .................................................-0.5V to 6.8V

VLED1 to VLED4....................................-1V to +55V

All Other Pins...............................-0.3V to +6.3V

Continuous Power Dissipation (TA = +25°C)

(2)

TSSOP16EP………………………………...2.78 W

SOIC16 ……………………………………1.56 W

SOIC20 …………………………………… 1.74W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ..............................5V to 28V

LED Current (Backlight) ...........10mA to 180mA

Operating Junction Temp. (TJ). -20°C to +125°C

Thermal Resistance

(4)

θJA

θJC

TSSOP16EP ...........................45 ...... 10 ...

°C/W

SOIC16 ...................................80 ...... 35 ...

°C/W

SOIC20 ...................................72 ...... 30 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operation conditions.

4) Measured on JESD51-7, 4-layer PCB.

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